Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related ...

China's auto industry has moved from capacity expansion and price competition into a final round of competition, as the ...

Accenture and Google Cloud launched a new global business group to help companies scale agentic AI, a move that could speed ...

Apple's fall product event will begin at 1 a.m. Taiwan time on September 10, with the company set to unveil the iPhone 18 Pro ...

One of Japan's few private technology companies valued above US$1 billion is preparing to abandon a decade of engineering ...

ASML's groundbreaking at Brainport Industries Campus North commits Europe's most valuable company to a build-out that could ...

Qualcomm's multi-generation agreement to build customized AI inference silicon and optical interconnects for Amazon gives the ...

Chinese GPU developer Biren Technology has teamed up with Shanghai University to establish an Integrated Circuit Intelligent ...

According to the latest DIGITIMES Intelligence report, US-based cloud service providers (CSPs) are expanding their footprint ...

As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the ...

As AI compute requirements scale, memory bandwidth has become a primary bottleneck governing system performance. PieceMakers ...

To receive 12-inch (300mm) advanced-process R&D and pilot-line equipment donated by TSMC, the Ministry of Economic Affairs ...